The 18 x 18 m structural bays and Stationkeeping/Docking Modules left in orbit by Mission 3 will be used as the test bed for mating demonstrations. Instrumentation for aligning the waveguide jigs, and measuring the alignment of the finished waveguide will be required. Figure 14-8(b) summarizes the flight sequence for Mission 4. The first flight will test various waveguide fabrication options on a small scale. Flights 2 and 3 evaluate the two leading candidate approaches to deployment and fabrication of aluminum waveguides; while Flights 4 and 5 demonstrate and collect data on fabrication of composite waveguides. Mission 5 - Electronics Integration The objective of Mission 5 is to demonstrate possible methods for installing electronics and wiring. This includes installation of amplitrons, their radiators, the power distribution system, and the command electronics. Tests will include a low level electronic checkout and a measurement of production rate. Figure 14-9(a) is a sketch of an automated approach to electronics integration. Equipments include: hold arms to support the assembly from Mission 4, and tracks required for an automated electronics integration module. In addition to the electronics (amplitrons, command electronic boxes, power distribution system switches), teleoperators and EVA, equipments for selected installations may be required. Shuttle support equipments include the RMS, Pallet, Airlock and Spacelab. Instrumentation would include an electronics checkout facility. Figure 14-9(b) is a matrix which relates Shuttle flights to test objectives. The first flight is configured to test installation methods on a small scale, using small sections of aluminum and composite waveguides. Flights 2 and 3 install electronics on the aluminum subarray left in orbit on Mission 4. Flights 4 and 5 install electronics on the composite subarray left in orbit, with a supporting stationkeeping/docking module.
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